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Appendix
Package Drawing – PLLP6 3.0 mm x 3.0 mm
3.10 (0.122)
3.00 (0.118)
0.45 (0.018)
0.98 (0.038)
0.93 (0.036)
0.45 (0.018)
0.35 (0.014)
1.55 (0.061)
1.45 (0.057)
0.40 (0.016)
0.12 (0.005)
2.30 (0.091)
2.20 (0.087)
0.02 (0.001)
1.00 (0.039)
0.85 (0.033)
0.05 (0.002)
0.00 (0.000)
Note: The PLLP6 package has thermal power dissipation of 320°C/Watt in free air. Attaching the package to
a circuit board improves thermal performance. Dimensions are in mm (inches).
Note on Lead-Free Packages
The electronics industry has been working to provide lead-free products in response to concerns about
the environmental impact of the use of lead (Pb) in solder finishes. Increasing customer demand and
directives to decrease the amounts of lead in consumer electronics products from governments around
the globe, drives this effort.
Lead-free finishes utilizing pure tin (Sn) have already been qualified at NVE and are available in most
of our products. However, additional lead times are associated with these parts.
Since most lead-free solders being used in board assembly environments have higher melting
temperatures than traditional tin-lead solders, higher reflow temperatures may be necessary to form an
equivalent solder joint between the component and the PC board. NVE characterizes all lead-free
packages using elevated temperature (245°C to 260°C) reflow profiles characteristic of lead-free board
assembly environments. All lead-free products will be identified with an “E” suffix on the part number
and a lower case “e” marking on the package.
This lead-free transition is an important component of NVE’s commitment to take an active part in
protecting the environment and our responsibility to our customers and the communities around the
world in which we do business. We remain dedicated to meeting our customers’ requirements and
expectations.
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